Smiths Connectors is now Smiths Interconnect


MarketID in (65)
  • Ideale per passi > 180 micron
  • Percorso del segnale ridotto < 3mm
  • Resistenza di contatto controllata per 750K cicli
  • Tecnologia brevettata
  • Elevate prestazioni di potenza

Monet for WLCSP is designed to incorporate the benefits of spring contact probe technology with the demands of wafer level packaging testing. The patent pending Monet solution allows for the robustness, replaceability and compliance of the spring probe while also addressing the fine pitches and coplanarity required for WLCSP. 

Mechanical & Environmental Specifications

Pitch Range ≥ 200 µm
Height (test/range) 2.92mm / 3.32mm
Working spring force 17 gf @ 0.40mm
Recommended travel 0.40mm
Operating Temperature -55 ~ 150 °C


Loop self inductance 0.56 nH
Mutual capacitance 0.6 pF
Bandwidth @ -1dB 10 GHz
Contact Resistance < 180 mΩ
Current carrying capability ~ 1.5 A continuous
*Specifications for ≥ 200 µm pitch 150 µm available soon